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Thermo-mechanical reliability of electronic packages

dc.contributor.authorGonzalez, Mario
dc.date.accessioned2021-10-20T11:14:53Z
dc.date.available2021-10-20T11:14:53Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20733
dc.sourceIIOimport
dc.titleThermo-mechanical reliability of electronic packages
dc.typeOral presentation
dc.contributor.imecauthorGonzalez, Mario
dc.source.peerreviewno
dc.source.conferenceThe Ultimate Innovation Day
dc.source.conferencedate4/10/2012
dc.source.conferencelocationEindhoven Netherland
imec.availabilityPublished - imec


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