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Metrology and inspection requirements for 3D stacking of ICs

dc.contributor.authorHalder, Sandip
dc.contributor.authorMiller, Andy
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorGrant, David
dc.contributor.authorMarx, David
dc.contributor.authorDudley, Russ
dc.contributor.authorFord, Maurice
dc.date.accessioned2021-10-20T11:25:34Z
dc.date.available2021-10-20T11:25:34Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20770
dc.sourceIIOimport
dc.titleMetrology and inspection requirements for 3D stacking of ICs
dc.typeProceedings paper
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage615
dc.source.endpage618
dc.source.conference62nd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2012
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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