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dc.contributor.authorHantschel, Thomas
dc.contributor.authorSchulze, Andreas
dc.contributor.authorDathe, Andre
dc.contributor.authorEyben, Pierre
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVereecke, Bart
dc.contributor.authorKe, Xiaoxing
dc.contributor.authorVandervorst, Wilfried
dc.date.accessioned2021-10-20T11:27:28Z
dc.date.available2021-10-20T11:27:28Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20777
dc.sourceIIOimport
dc.titleThree-dimensional electrical profiling of carbon nanotube interconnects
dc.typeMeeting abstract
dc.contributor.imecauthorHantschel, Thomas
dc.contributor.imecauthorEyben, Pierre
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVereecke, Bart
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecHantschel, Thomas::0000-0001-9476-4084
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.source.peerreviewno
dc.source.beginpageDD15.32
dc.source.conferenceMRS Spring Meeting Symposium DD: De Novo Carbon Materials
dc.source.conferencedate9/04/2012
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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