Show simple item record

Novel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSV

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorRadisic, Alex
dc.contributor.authorArmini, Silvia
dc.contributor.authorCivale, Yann
dc.contributor.authorLeunissen, Peter
dc.contributor.authorShingubara, Shoso
dc.date.accessioned2021-10-20T11:47:48Z
dc.date.available2021-10-20T11:47:48Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20847
dc.sourceIIOimport
dc.titleNovel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSV
dc.typeProceedings paper
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2012
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://dx.doi.org/10.1109/IITC.2012.6251660
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record