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FET arrays as CPI sensors for 3D stacking and packaging characterization

dc.contributor.authorIvankovic, Andrej
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVandepitte, Dirk
dc.date.accessioned2021-10-20T11:49:01Z
dc.date.available2021-10-20T11:49:01Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20851
dc.sourceIIOimport
dc.titleFET arrays as CPI sensors for 3D stacking and packaging characterization
dc.typeProceedings paper
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage2.00E-03
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate15/04/2012
dc.source.conferencelocationAnaheim, CA USA
imec.availabilityPublished - imec


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