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Early resistance change and stress/electromigration modeling in aluminum interconnects

dc.contributor.authorPetrescu, Violeta
dc.contributor.authorMouthaan, A. J.
dc.contributor.authorSchoenmaker, Wim
dc.date.accessioned2021-09-30T09:24:26Z
dc.date.available2021-09-30T09:24:26Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2086
dc.sourceIIOimport
dc.titleEarly resistance change and stress/electromigration modeling in aluminum interconnects
dc.typeJournal article
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1491
dc.source.endpage1494
dc.source.journalMicroelectronics and Reliability
dc.source.issue10_11
dc.source.volume37
imec.availabilityPublished - open access
imec.internalnotesSpecial Issue 8th European Sympoaium on Electron Devices, Failure Physics and Analysis (ESREF 97)


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