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Multiple die-to-wafer adhesive bonding for heterogeneous integration

dc.contributor.authorKeyvaninia, Shahram
dc.contributor.authorMuneeb, Muhammad
dc.contributor.authorStankovic, Stevan
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorFedeli, J.M.
dc.date.accessioned2021-10-20T12:11:25Z
dc.date.available2021-10-20T12:11:25Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20922
dc.sourceIIOimport
dc.titleMultiple die-to-wafer adhesive bonding for heterogeneous integration
dc.typeProceedings paper
dc.contributor.imecauthorMuneeb, Muhammad
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conference16th European Conference on Integrated Optics - ECIO
dc.source.conferencedate18/04/2012
dc.source.conferencelocationBarcelona Spain
imec.availabilityPublished - open access


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