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Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

dc.contributor.authorKeyvaninia, Shahram
dc.contributor.authorMuneeb, Muhammad
dc.contributor.authorStankovic, Stevan
dc.contributor.authorvan Veldhoven, P.J.
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorRoelkens, Gunther
dc.date.accessioned2021-10-20T12:11:44Z
dc.date.available2021-10-20T12:11:44Z
dc.date.issued2012-12
dc.identifier.issn2159-3930
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20923
dc.sourceIIOimport
dc.titleUltra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate
dc.typeJournal article
dc.contributor.imecauthorMuneeb, Muhammad
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage35
dc.source.endpage46
dc.source.journalOptical Materials Express
dc.source.issue1
dc.source.volume3
imec.availabilityPublished - open access


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