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Initial void characterization in 30nm wide polycrystalline Cu line using a local sense EM test structure

dc.contributor.authorKirimura, Tomoyuki
dc.contributor.authorCroes, Kristof
dc.contributor.authorLi, Yunlong
dc.contributor.authorDemuynck, Steven
dc.contributor.authorWilson, Chris
dc.contributor.authorLofrano, Melina
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-20T12:17:28Z
dc.date.available2021-10-20T12:17:28Z
dc.date.issued2012-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20940
dc.sourceIIOimport
dc.titleInitial void characterization in 30nm wide polycrystalline Cu line using a local sense EM test structure
dc.typeProceedings paper
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.source.peerreviewyes
dc.source.beginpage6B.4.1
dc.source.endpage6B.4.6
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate17/04/2012
dc.source.conferencelocationAnaheim CA, USA
imec.availabilityPublished - imec


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