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Impact of curing condition on chemical stability of ultralow-k PMO material

dc.contributor.authorKrishtab, Mikhail
dc.contributor.authorZhang, Liping
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorVanstreels, Kris
dc.contributor.authorSouriau, Laurent
dc.contributor.authorPhillips, Mark
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-20T12:21:46Z
dc.date.available2021-10-20T12:21:46Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20952
dc.sourceIIOimport
dc.titleImpact of curing condition on chemical stability of ultralow-k PMO material
dc.typeProceedings paper
dc.contributor.imecauthorKrishtab, Mikhail
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorSouriau, Laurent
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecSouriau, Laurent::0000-0002-5138-5938
dc.source.peerreviewyes
dc.source.beginpagemrss12-1428-c02-
dc.source.conferenceInterconnect Challenges for CMOS Technology - Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking
dc.source.conferencedate9/04/2012
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMRS SYmposium Proceedings; Vol. 1428


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