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Small pitch micro-bumping and experimental investigation for under filling 3D stacking

dc.contributor.authorLa Manna, Antonio
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorGerets, Carine
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T12:28:54Z
dc.date.available2021-10-20T12:28:54Z
dc.date.issued2012-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20974
dc.sourceIIOimport
dc.titleSmall pitch micro-bumping and experimental investigation for under filling 3D stacking
dc.typeProceedings paper
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage535
dc.source.endpage541
dc.source.conferenceIMAPS 45th International Symposium on Microelectronics
dc.source.conferencedate9/09/2012
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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