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Use of wafer applied underfill for 3D stacking

dc.contributor.authorLa Manna, Antonio
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorGerets, Carine
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T12:29:14Z
dc.date.available2021-10-20T12:29:14Z
dc.date.issued2012
dc.identifier.issn1551-4897
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20975
dc.sourceIIOimport
dc.titleUse of wafer applied underfill for 3D stacking
dc.typeJournal article
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage10
dc.source.endpage18
dc.source.journalJournal of Microelectronics and Electronic Packaging
dc.source.issue1
dc.source.volume9
dc.identifier.urlhttp://www.imaps.org/imapsstore/detail.aspx?ID=3924
imec.availabilityPublished - imec


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