Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Articles
View item
imec Publications Repository
imec Publications
Articles
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
Use of wafer applied underfill for 3D stacking
Metadata
Show full item record
Authors
La Manna, Antonio
;
Rebibis, Kenneth June
;
Gerets, Carine
;
Beyne, Eric
ISSN
1551-4897
Issue
1
Journal
Journal of Microelectronics and Electronic Packaging
Volume
9
Title
Use of wafer applied underfill for 3D stacking
Publication type
Journal article
Collections
Articles
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login