Publication:

Use of wafer applied underfill for 3D stacking

Date

2012
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorGerets, Carine
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T12:29:14Z
dc.date.available2021-10-20T12:29:14Z
dc.date.issued2012
dc.identifier.issn1551-4897
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20975
dc.identifier.urlhttp://www.imaps.org/imapsstore/detail.aspx?ID=3924
dc.source.beginpage10
dc.source.endpage18
dc.source.issue1
dc.source.journalJournal of Microelectronics and Electronic Packaging
dc.source.volume9
dc.title

Use of wafer applied underfill for 3D stacking

dc.typeJournal article
dspace.entity.typePublication
Files
Publication available in collections:
Articles