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3D stacking using ultra thin dies

dc.contributor.authorLa Manna, Antonio
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorBuisson, Thibault
dc.contributor.authorDetalle, Mikael
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorZhang, Wenqi
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T12:29:34Z
dc.date.available2021-10-20T12:29:34Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20976
dc.sourceIIOimport
dc.title3D stacking using ultra thin dies
dc.typeProceedings paper
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage3-Mar
dc.source.conferenceIEEE International 3D System Integration Conference - 3DIC
dc.source.conferencedate31/01/2012
dc.source.conferencelocationOsaka Japan
imec.availabilityPublished - open access


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