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Die-to-Die and Die-to-Wafer bonding solutions for high density, fine pitch micro-bumped die

dc.contributor.authorLecarpentier, Gilbert
dc.contributor.authorDe Vos, Joeri
dc.date.accessioned2021-10-20T12:35:44Z
dc.date.available2021-10-20T12:35:44Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20995
dc.sourceIIOimport
dc.titleDie-to-Die and Die-to-Wafer bonding solutions for high density, fine pitch micro-bumped die
dc.typeProceedings paper
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.source.peerreviewno
dc.source.conferenceIMAPS 8th International Conference and Exhibition on Device Packaging
dc.source.conferencedate5/03/2012
dc.source.conferencelocationScottsdale, AZ USA
imec.availabilityPublished - imec


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