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A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects

dc.contributor.authorLofrano, Melina
dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-20T12:55:07Z
dc.date.available2021-10-20T12:55:07Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21051
dc.sourceIIOimport
dc.titleA calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects
dc.typeMeeting abstract
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpageP3-08
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate11/03/2012
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - open access


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