Show simple item record

Fine pitch interconnection using anisotropic conducting adhesives

dc.contributor.authorReese, E.
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-09-30T09:26:56Z
dc.date.available2021-09-30T09:26:56Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2105
dc.sourceIIOimport
dc.titleFine pitch interconnection using anisotropic conducting adhesives
dc.typeProceedings paper
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage457
dc.source.endpage464
dc.source.conferenceProceedings of the 11th European Microelectronics Conference; 14-16 May 1997. Venice, Italy.
dc.source.conferencelocation
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record