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Process integration solution for damage-free bevel for deep Si etch applications

dc.contributor.authorMajeed, Bivragh
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorFiorini, Paolo
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.date.accessioned2021-10-20T13:06:13Z
dc.date.available2021-10-20T13:06:13Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21080
dc.sourceIIOimport
dc.titleProcess integration solution for damage-free bevel for deep Si etch applications
dc.typeProceedings paper
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage169
dc.source.endpage175
dc.source.conferenceIMAPS 45th International Symposium on Microelectronics
dc.source.conferencedate9/09/2012
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access
imec.internalnotes


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