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Reliability study of reference semiconductor encapsulation materials for biocompatible packaging

dc.contributor.authorMalachowski, Karl
dc.contributor.authorQian, Karen
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorVerbeeck, Rita
dc.contributor.authorBryce, George
dc.contributor.authorDekkers, Harold
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.date.accessioned2021-10-20T13:06:58Z
dc.date.available2021-10-20T13:06:58Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21082
dc.sourceIIOimport
dc.titleReliability study of reference semiconductor encapsulation materials for biocompatible packaging
dc.typeProceedings paper
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVerbeeck, Rita
dc.contributor.imecauthorBryce, George
dc.contributor.imecauthorDekkers, Harold
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecDekkers, Harold::0000-0003-4778-5709
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage148
dc.source.endpage153
dc.source.conferenceIMAPS 45th International Symposium on Microelectronics
dc.source.conferencedate9/09/2012
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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