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3D chip stacking: the sky is the limit

dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-20T13:14:22Z
dc.date.available2021-10-20T13:14:22Z
dc.date.issued2012-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21102
dc.sourceIIOimport
dc.title3D chip stacking: the sky is the limit
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.conferenceIEEE European Test Symposium - ETS
dc.source.conferencedate29/05/2012
dc.source.conferencelocationAnnecy France
imec.availabilityPublished - imec


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