Challenges and emerging solutions in testing 2.5D- and 3D-stacked ICs
dc.contributor.author | Marinissen, Erik Jan | |
dc.date.accessioned | 2021-10-20T13:14:41Z | |
dc.date.available | 2021-10-20T13:14:41Z | |
dc.date.issued | 2012 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21103 | |
dc.source | IIOimport | |
dc.title | Challenges and emerging solutions in testing 2.5D- and 3D-stacked ICs | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Marinissen, Erik Jan | |
dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
dc.source.peerreview | no | |
dc.source.conference | Semicon Japan 2012 | |
dc.source.conferencedate | 5/12/2012 | |
dc.source.conferencelocation | Chiba Japan | |
imec.availability | Published - imec |
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