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Articles
A DfT architecture for 3D-SICs based on a standardizable die wrapper
Publication:
A DfT architecture for 3D-SICs based on a standardizable die wrapper
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Date
2012
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marinissen, Erik Jan
;
Chi, Chun-Chuan
;
Konijnenburg, Mario
;
Verbree, Jouke
Journal
Journal of Electronic Testing - Theory and Applications
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1934
since deposited on 2021-10-20
Acq. date: 2026-07-17
Citations
Statistics
Views
1934
since deposited on 2021-10-20
Acq. date: 2026-07-17
Citations