Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
A DfT architecture for 3D-SICs based on a standardizable die wrapper
Publication:
A DfT architecture for 3D-SICs based on a standardizable die wrapper
Copy permalink
Date
2012-02
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marinissen, Erik Jan
;
Chi, Chun-Chuan
;
Konijnenburg, Mario
;
Verbree, Jouke
Journal
Journal of Electronic Testing - Theory and Applications
Abstract
Description
Metrics
Views
1928
since deposited on 2021-10-20
2
last month
Acq. date: 2025-12-14
Citations
Metrics
Views
1928
since deposited on 2021-10-20
2
last month
Acq. date: 2025-12-14
Citations