A DfT architecture for 3D-SICs based on a standardizable die wrapper

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Authors

Marinissen, Erik Jan; Chi, Chun-Chuan; Konijnenburg, Mario; Verbree, Jouke

ISSN

0923-8174

Issue

1

Journal

Journal of Electronic Testing - Theory and Applications

Volume

28

Title

A DfT architecture for 3D-SICs based on a standardizable die wrapper

Publication type

Journal article

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