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Guest editorial: Special issue on testing of 3D stacked integrated circuits

dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorZorian, Yervant
dc.date.accessioned2021-10-20T13:16:13Z
dc.date.available2021-10-20T13:16:13Z
dc.date.issued2012-02
dc.identifier.issn0923-8174
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21107
dc.sourceIIOimport
dc.titleGuest editorial: Special issue on testing of 3D stacked integrated circuits
dc.typeJournal article
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage13
dc.source.endpage14
dc.source.journalJournal of Electronic Testing
dc.source.issue1
dc.source.volume28
dc.identifier.urlhttp://dx.doi.org/10.1007/s10836-012-5279-2
imec.availabilityPublished - imec


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