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Transient analysis based thermal characterization of die-die interfaces in 3D-ICs

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorVermeersch, Kristina
dc.contributor.authorGerets, Carine
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T14:06:42Z
dc.date.available2021-10-20T14:06:42Z
dc.date.issued2012-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21234
dc.sourceIIOimport
dc.titleTransient analysis based thermal characterization of die-die interfaces in 3D-ICs
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1395
dc.source.endpage1404
dc.source.conference13th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm
dc.source.conferencedate30/05/2012
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec
imec.internalnotesBest Paper Award (1st Place) Thermal Track


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