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Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T14:07:07Z
dc.date.available2021-10-20T14:07:07Z
dc.date.issued2012-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21235
dc.sourceIIOimport
dc.titleNumerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1081
dc.source.endpage1088
dc.source.conference62nd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate30/05/2012
dc.source.conferencelocationSan Diego CA USA
imec.availabilityPublished - imec


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