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Metallization for 3D interconnect processing

dc.contributor.authorPhilipsen, Harold
dc.contributor.authorCivale, Yann
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorHonore, Mia
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-20T14:33:40Z
dc.date.available2021-10-20T14:33:40Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21299
dc.sourceIIOimport
dc.titleMetallization for 3D interconnect processing
dc.typeMeeting abstract
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.source.peerreviewyes
dc.source.beginpage2717
dc.source.conferenceECS Fall Meeting Symposium E8: Processing Materials of 3D Interconnects
dc.source.conferencedate7/10/2012
dc.source.conferencelocationHonolulu, HI USA
dc.identifier.urlhttp://ecsdl.org/getpdf/servlet/GetPDFServlet?filetype=pdf&id=MAECES001202000034002717000001&idtype=cvips
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. 2012-02


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