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Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors

dc.contributor.authorSercu, Stefaan
dc.contributor.authorMartens, Luc
dc.date.accessioned2021-09-30T09:30:37Z
dc.date.available2021-09-30T09:30:37Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2129
dc.sourceIIOimport
dc.titleAccurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors
dc.typeProceedings paper
dc.contributor.imecauthorMartens, Luc
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage177
dc.source.endpage180
dc.source.conferenceIEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging
dc.source.conferencedate27/10/1997
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - open access


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