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Evolution of temporary wafer (de)bonding technology towards low temperature processes for enhanced 3D integration

dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorJourdain, Anne
dc.contributor.authorBex, Pieter
dc.contributor.authorVan den Eede, Axel
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T14:34:33Z
dc.date.available2021-10-20T14:34:33Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21301
dc.sourceIIOimport
dc.titleEvolution of temporary wafer (de)bonding technology towards low temperature processes for enhanced 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorVan den Eede, Axel
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage229
dc.source.endpage233
dc.source.conference3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - LTB-3D
dc.source.conferencedate22/05/2012
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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