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Process characterization of thin wafer debonding with thermoplastic materials

dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorJourdain, Anne
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorWoitke, Tobias
dc.contributor.authorStieber, Ralf
dc.contributor.authorBisson, Peter
dc.contributor.authorGabriel, Markus
dc.contributor.authorSpiess, Walter
dc.contributor.authorGuerrero, Alice
dc.contributor.authorMcCutcheon, Jeremy
dc.contributor.authorPuligadda, Rama
dc.contributor.authorBex, Pieter
dc.contributor.authorVan den Eede, Axel
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T14:35:35Z
dc.date.available2021-10-20T14:35:35Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21303
dc.sourceIIOimport
dc.titleProcess characterization of thin wafer debonding with thermoplastic materials
dc.typeProceedings paper
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorVan den Eede, Axel
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conference4th Electronics System Integration technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
imec.availabilityPublished - imec


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