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Novel minaturized packaging for implantable electronic devices

dc.contributor.authorQian, Karen
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorBryce, George
dc.contributor.authorMalachowski, Karl
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-20T14:58:24Z
dc.date.available2021-10-20T14:58:24Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21358
dc.sourceIIOimport
dc.titleNovel minaturized packaging for implantable electronic devices
dc.typeProceedings paper
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorBryce, George
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2012
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - open access


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