dc.contributor.author | Rebibis, Kenneth June | |
dc.contributor.author | La Manna, Antonio | |
dc.contributor.author | Gerets, Carine | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Daily, Robert | |
dc.contributor.author | Capuz, Giovanni | |
dc.date.accessioned | 2021-10-20T15:11:00Z | |
dc.date.available | 2021-10-20T15:11:00Z | |
dc.date.issued | 2012 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21387 | |
dc.source | IIOimport | |
dc.title | Underfill material screening and process characterization for 3D stacking | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Rebibis, Kenneth June | |
dc.contributor.imecauthor | La Manna, Antonio | |
dc.contributor.imecauthor | Gerets, Carine | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Capuz, Giovanni | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Capuz, Giovanni::0000-0002-5263-4836 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.conference | 4th Electronics System Integration Technologies Conference - ESTC | |
dc.source.conferencedate | 17/09/2012 | |
dc.source.conferencelocation | Amsterdam The Netherlands | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6542099&queryText%3DUnderfill+material+screening+and+process+char | |
imec.availability | Published - open access | |