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Opportunities and challenges in device scaling by the introduction of EUV lithography

dc.contributor.authorRonse, Kurt
dc.contributor.authorDe Bisschop, Peter
dc.contributor.authorVandenberghe, Geert
dc.contributor.authorHendrickx, Eric
dc.contributor.authorGronheid, Roel
dc.contributor.authorVaglio Pret, Alessandro
dc.contributor.authorMallik, Arindam
dc.contributor.authorVerkest, Diederik
dc.contributor.authorSteegen, An
dc.date.accessioned2021-10-20T15:29:19Z
dc.date.available2021-10-20T15:29:19Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21425
dc.sourceIIOimport
dc.titleOpportunities and challenges in device scaling by the introduction of EUV lithography
dc.typeProceedings paper
dc.contributor.imecauthorRonse, Kurt
dc.contributor.imecauthorDe Bisschop, Peter
dc.contributor.imecauthorVandenberghe, Geert
dc.contributor.imecauthorHendrickx, Eric
dc.contributor.imecauthorGronheid, Roel
dc.contributor.imecauthorVaglio Pret, Alessandro
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorVerkest, Diederik
dc.contributor.orcidimecRonse, Kurt::0000-0003-0803-4267
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.contributor.orcidimecVerkest, Diederik::0000-0001-6567-2746
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage18.5
dc.source.conferenceInternational Electron Devices Meeting - IEDM
dc.source.conferencedate10/12/2012
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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