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Verification of back-to-front-side alignment for advanced packaging

dc.contributor.authorSlabbekoorn, John
dc.contributor.authorMiller, Andy
dc.date.accessioned2021-10-20T16:15:11Z
dc.date.available2021-10-20T16:15:11Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21524
dc.sourceIIOimport
dc.titleVerification of back-to-front-side alignment for advanced packaging
dc.typeProceedings paper
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorMiller, Andy
dc.source.peerreviewyes
dc.source.conferenceInternational Wafer-Level Packaging Conference - IWPLC
dc.source.conferencedate7/11/2012
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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