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Novel methodology to integrate ultra-thin chips on flexible foils

dc.contributor.authorSridhar, Ashok
dc.contributor.authorCauwe, Maarten
dc.contributor.authorKusters, Roel
dc.contributor.authorFledderus, H
dc.contributor.authorvan den Brand, Jeroen
dc.date.accessioned2021-10-20T16:23:19Z
dc.date.available2021-10-20T16:23:19Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21542
dc.sourceIIOimport
dc.titleNovel methodology to integrate ultra-thin chips on flexible foils
dc.typeProceedings paper
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conference4th Electronics System Integration technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
imec.availabilityPublished - open access


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