Show simple item record

3D-COSTAR: A cost model for 3D-SICs

dc.contributor.authorTaouil, Mottaqiallah
dc.contributor.authorHamdioui, Said
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorBhawmik, Sudipta
dc.date.accessioned2021-10-20T16:48:58Z
dc.date.available2021-10-20T16:48:58Z
dc.date.issued2012-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21595
dc.sourceIIOimport
dc.title3D-COSTAR: A cost model for 3D-SICs
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.conference3-D Architectures for Semiconductor Integration and Packaging - 3D-ASIP
dc.source.conferencedate12/12/2012
dc.source.conferencelocationRedwood City, CA USA
dc.identifier.urlhttp://techventure.rti.org/Login.html
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record