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Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips to striplines
Publication:
Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips to striplines
Date
1994
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kok, Peter
;
De Zutter, Daniel
Journal
IEEE Trans. Microwave Theory and Techniques
Abstract
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1991
since deposited on 2021-09-29
4
last month
1
last week
Acq. date: 2025-12-07
Citations
Metrics
Views
1991
since deposited on 2021-09-29
4
last month
1
last week
Acq. date: 2025-12-07
Citations