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Novel 3D integration process flow: backside 'soft' via reveal

dc.contributor.authorVan Bavel, Mieke
dc.date.accessioned2021-10-20T17:30:34Z
dc.date.available2021-10-20T17:30:34Z
dc.date.issued2012-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21679
dc.sourceIIOimport
dc.titleNovel 3D integration process flow: backside 'soft' via reveal
dc.typeJournal article
dc.contributor.imecauthorVan Bavel, Mieke
dc.source.peerreviewno
dc.source.beginpage36
dc.source.journalSilicon Semiconductor
dc.source.issue2
dc.source.volume34
imec.availabilityPublished - imec


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