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Articles
Novel 3D integration process flow: backside 'soft' via reveal
Publication:
Novel 3D integration process flow: backside 'soft' via reveal
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Date
2012-06
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Van Bavel, Mieke
Journal
Silicon Semiconductor
Abstract
Description
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1815
since deposited on 2021-10-20
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last month
Acq. date: 2025-12-18
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Metrics
Views
1815
since deposited on 2021-10-20
1
last month
Acq. date: 2025-12-18
Citations