Publication:
Novel 3D integration process flow: backside 'soft' via reveal
Date
| dc.contributor.author | Van Bavel, Mieke | |
| dc.contributor.imecauthor | Van Bavel, Mieke | |
| dc.date.accessioned | 2021-10-20T17:30:34Z | |
| dc.date.available | 2021-10-20T17:30:34Z | |
| dc.date.issued | 2012-06 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21679 | |
| dc.source.beginpage | 36 | |
| dc.source.issue | 2 | |
| dc.source.journal | Silicon Semiconductor | |
| dc.source.volume | 34 | |
| dc.title | Novel 3D integration process flow: backside 'soft' via reveal | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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