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dc.contributor.authorKok, Peter
dc.contributor.authorDe Zutter, Daniel
dc.date.accessioned2021-09-29T12:42:42Z
dc.date.available2021-09-29T12:42:42Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/216
dc.sourceIIOimport
dc.titlePrediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips to striplines
dc.typeJournal article
dc.contributor.imecauthorDe Zutter, Daniel
dc.source.peerreviewno
dc.source.beginpage1229
dc.source.endpage1237
dc.source.journalIEEE Trans. Microwave Theory and Techniques
dc.source.issue12, pt.1
dc.source.volume42
imec.availabilityPublished - imec


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