Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips to striplines
| dc.contributor.author | Kok, Peter | |
| dc.contributor.author | De Zutter, Daniel | |
| dc.date.accessioned | 2021-09-29T12:42:42Z | |
| dc.date.available | 2021-09-29T12:42:42Z | |
| dc.date.issued | 1994 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/216 | |
| dc.source | IIOimport | |
| dc.title | Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips to striplines | |
| dc.type | Journal article | |
| dc.contributor.imecauthor | De Zutter, Daniel | |
| dc.source.peerreview | no | |
| dc.source.beginpage | 1229 | |
| dc.source.endpage | 1237 | |
| dc.source.journal | IEEE Trans. Microwave Theory and Techniques | |
| dc.source.issue | 12, pt.1 | |
| dc.source.volume | 42 | |
| imec.availability | Published - imec |
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