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Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds

dc.contributor.authorVandevelde, Bart
dc.contributor.authorWillems, Geert
dc.date.accessioned2021-10-20T18:03:45Z
dc.date.available2021-10-20T18:03:45Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21745
dc.sourceIIOimport
dc.titleEarly fatigue failures in copper wire bonds inside packages with low CTE green mold compounds
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.source.peerreviewyes
dc.source.conference4th Electronics System Integration technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
imec.availabilityPublished - imec


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