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Cost comparison between 3D and 2.5D integration

dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorDetalle, Mikael
dc.contributor.authorCivale, Yann
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T18:11:20Z
dc.date.available2021-10-20T18:11:20Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21760
dc.sourceIIOimport
dc.titleCost comparison between 3D and 2.5D integration
dc.typeProceedings paper
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conference4th Electronics System Integration Technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam Netherlands
imec.availabilityPublished - imec


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