Show simple item record

Interposer technology for high-speed, high-density interconnects

dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorDetalle, Mikael
dc.contributor.authorSun, Xiao
dc.contributor.authorKim, Jaemin
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T18:11:48Z
dc.date.available2021-10-20T18:11:48Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21761
dc.sourceIIOimport
dc.titleInterposer technology for high-speed, high-density interconnects
dc.typeOral presentation
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceGlobal Interposer Technology Workshop
dc.source.conferencedate14/11/2012
dc.source.conferencelocationAtlanta, GA USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record