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A parylene temporary packaging technique for MEMS wafer handling

dc.contributor.authorWen, Lianggong
dc.contributor.authorWouters, K.
dc.contributor.authorCeyssens, F.
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorPuers, Bob
dc.date.accessioned2021-10-20T18:56:54Z
dc.date.available2021-10-20T18:56:54Z
dc.date.issued2012
dc.identifier.issn0924-4247
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21846
dc.sourceIIOimport
dc.titleA parylene temporary packaging technique for MEMS wafer handling
dc.typeJournal article
dc.contributor.imecauthorPuers, Bob
dc.source.peerreviewyes
dc.source.beginpage289
dc.source.endpage297
dc.source.journalSensors and Actuators A: Physical
dc.source.volume186
dc.identifier.urlhttp://dx.doi.org/10.1016/j.sna2012.03.047
imec.availabilityPublished - imec


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