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Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's

dc.contributor.authorWilson, Chris
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorAblett, James M.
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorSimons, Veerle
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-20T18:59:00Z
dc.date.available2021-10-20T18:59:00Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21850
dc.sourceIIOimport
dc.titleComparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's
dc.typeProceedings paper
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorSimons, Veerle
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2012
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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