dc.contributor.author | Zhang, Wenqi | |
dc.contributor.author | La Manna, Antonio | |
dc.contributor.author | Soussan, Philippe | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-20T19:38:13Z | |
dc.date.available | 2021-10-20T19:38:13Z | |
dc.date.issued | 2012 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21924 | |
dc.source | IIOimport | |
dc.title | Fine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarization | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | La Manna, Antonio | |
dc.contributor.imecauthor | Soussan, Philippe | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 65 | |
dc.source.conference | 3rd IEEE International Workshop on Low Temperature Bonding for 3D integration - LTB-3D | |
dc.source.conferencedate | 22/05/2012 | |
dc.source.conferencelocation | Tokyo Japan | |
imec.availability | Published - open access | |