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Fine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarization

dc.contributor.authorZhang, Wenqi
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-20T19:38:13Z
dc.date.available2021-10-20T19:38:13Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21924
dc.sourceIIOimport
dc.titleFine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarization
dc.typeProceedings paper
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage65
dc.source.conference3rd IEEE International Workshop on Low Temperature Bonding for 3D integration - LTB-3D
dc.source.conferencedate22/05/2012
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - open access


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