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Effect of precoat on the sidewall profile of through silicon via's

dc.contributor.authorBabaei Gavan, Khashayar
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorBrouri, Mohand
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorKunnen, Eddy
dc.contributor.authorXu, Kaidong
dc.date.accessioned2021-10-21T06:43:41Z
dc.date.available2021-10-21T06:43:41Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22002
dc.sourceIIOimport
dc.titleEffect of precoat on the sidewall profile of through silicon via's
dc.typeMeeting abstract
dc.contributor.imecauthorBabaei Gavan, Khashayar
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecde Marneffe, Jean-Francois::0000-0001-5178-6670
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferencePlasma Etch and Strip in Microtechnology - PESM
dc.source.conferencedate14/03/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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