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Exploring process interaction of no-flow underfill and thermo-compression bonding in D2D stacking

dc.contributor.authorCapuz, Giovanni
dc.contributor.authorDaily, Robert
dc.contributor.authorWang, Teng
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMiller, Andy
dc.contributor.authorRebibis, Kenneth June
dc.date.accessioned2021-10-21T06:52:24Z
dc.date.available2021-10-21T06:52:24Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22100
dc.sourceIIOimport
dc.titleExploring process interaction of no-flow underfill and thermo-compression bonding in D2D stacking
dc.typeMeeting abstract
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.source.peerreviewyes
dc.source.beginpagena
dc.source.conferenceInternational Wafer-Level Packaging Conference - IWLPC
dc.source.conferencedate5/11/2013
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=3841
imec.availabilityPublished - imec


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