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Conformal electroless deposition on monolayers for TSV applications

dc.contributor.authorCervati, Michele
dc.contributor.authorCarnevali, Guido
dc.contributor.authorArmini, Silvia
dc.contributor.authorMagagnin, Luca
dc.date.accessioned2021-10-21T06:54:50Z
dc.date.available2021-10-21T06:54:50Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22119
dc.sourceIIOimport
dc.titleConformal electroless deposition on monolayers for TSV applications
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage2366
dc.source.conferenceECS Fall Meeting
dc.source.conferencedate26/10/2013
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2013-02/38/2366.abstract
imec.availabilityPublished - open access
imec.internalnotesECS Meeting Abstracts; Vol. MA2013-02


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